Annoncement for the 1st International Electronic Conference on Materials

Benjamin will co-chair the 1st International Electronic Conference on Materials organized through the sciforum.net platform.

The sciforum.net is a platform providing the technology to host digital conferences which address many of the difficulties that come with participating in a physical conference: ECM offers the opportunity to participate at this international, scholarly conference without having the concern or expenditure of travel. In addition, participation is free of charge—both for authors and attendees. Furthermore, the e-conference offers a rapid and direct exchange with the scientific community.

The 1st International Electronic Conference on Materials is sponsored by the open access journal Materials (2012 Impact Factor: 2.247; http://www.mdpi.com/journal/materials). Accepted papers will be published in the proceedings of the conference, and selected papers will be considered for publication in Materials. Papers related to functional biomaterials can also be submitted to the Journal of Functional Biomaterials (http://www.mdpi.com/journal/jfb).

This first edition will focus on the issue of “Functional Materials and Interfaces”. All participants will have the chance to exchange their knowledge and latest research with other experts from the community, bringing a rich contribution to this important field. Researchers from both theoretical and applied fields will convene to discuss their latest investigations. The ECM 2014 conference will cover specific areas related to material science, which give an overall input from divers sections of the field and which will be chaired by well-known experts.

Deadline for Abstract Submission: 1 April 2014

Deadline for Acceptance: 14 April 2014

Deadline for Submission of Proceedings Paper: 4 May 2014

Conference Open: 26 May–10 June 2014

Comments are closed.